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1/12 msm5052 ? semiconductor general description the msm5052 is a low-power microcontroller manufactured in complementary metal-oxide semiconductor technology. integrated into a single chip are rom, ram, crystal oscillator, voltage doubler, timer, lcd driver, input port, output port, and thermistor-based temperature measuring circuit. using an on-chip rom reduces power consumption. the msm5052 is widely used in electronic products requiring low-power operation, for example, thermometer and clinical thermometer. features ? low power consumption ? internal rom : 1280 14 bits ? internal ram : 62 4 bits ? i/o port input port : 2 ports 4 bits output port : 1 port 4 bits 1 port 1 bit ?4 4 key matrix input is available by using k 1 to k 4 and m 1 to m 4 ? 26 lcd drivers (1/2 duty, 1/2 bias, 52 segments) ? 42 instructions ? minimum instruction execution time : 122.1 m s (display instruction cycle: 244.2 m s) ? 1.5 v operating voltage (built-in lcd drive voltage doubler) ? buzzer function ? built-in thermistor-based temperature measuring circuit ? crystal oscillator : 32.768 khz ? package options: 56-pin plastic qfp (qfp56-p-910-0.65-k) : (product name : msm5052- gs-k) 56-pin plastic qfp (qfp56-p-910-0.65-2k) : (product name : msm5052- gs-2k) 80-pin plastic qfp (qfp80-p-1420-0.80-bk): (product name : msm5052- gs-bk) chip (chip size 4.77 mm 4.36 mm) : (product name : msm5052- ) indicates a code number. ? semiconductor msm5052 built-in temperature circuit and lcd driver 4-bit microcontroller e2e0008-38-94 this version: sep. 1998 previous version: mar. 1996
2/12 msm5052 ? semiconductor block diagram buzzer driver output port (m1-m4) input port (k1-k4) input port (s1-s4) timing generator alu acc din 0 to din 3 dout 0 to dout 3 a6 to a4 a3 to a0 data ram 62 4 bits mpx mpx pro- gram coun- ter dout 13 to dout 0 a 0 to a 10 program rom 1280 14 bits instruc -tion decoder display latch and driver v dd v ss1 v ss2 v cp v cm reset t 1 t 2 t 3 t 4 t 5 bd m 1 to m 4 k 1 to k 4 s 1 to s 4 xt segment out 1 to segment out 26 mpx c z xt output port ld fmt register com 1 com 2 p register counter rc oscillator osc th osc r osc c osc in mpx
3/12 msm5052 ? semiconductor pin configuration (top view) seg4 1 seg6 2 seg8 3 seg9 4 seg10 5 seg12 6 seg13 7 seg14 8 seg15 9 seg18 10 seg20 11 seg21 12 seg22 13 seg23 14 nc osc th osc r osc in osc c k 4 k 3 k 2 k 1 ld m 4 m 3 m 2 m 1 42 41 40 39 38 37 36 35 34 33 32 31 30 29 43 44 45 46 47 48 49 50 51 52 53 54 55 56 28 27 26 25 24 23 22 21 20 19 18 17 16 15 nc v ss1 v ss2 bd t 5 t 4 v dd t 2 t 1 t 3 com1 seg1 seg2 seg3 s 4 s 3 s 2 s 1 v cm v cp reset v dd xt nc xt com2 seg25 seg24 nc: no-connection pin 56-pin plastic qfp note: seg5, seg7, seg11, seg16, seg17, seg19, and seg26 are not connected to package pins.
4/12 msm5052 ? semiconductor v ss1 v ss2 v dd bd t 5 t 4 t 2 nc t 1 t 3 nc nc nc com1 seg1 seg2 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 nc nc osc th nc osc r nc osc in nc osc c k 4 nc k 3 k 2 nc k 1 ld m 4 m 3 m 2 nc m 1 nc nc s 4 seg3 seg4 seg5 seg6 seg7 seg8 seg9 seg10 seg11 seg12 seg13 nc seg14 seg15 seg16 seg17 seg18 seg19 seg20 seg21 seg22 seg23 seg24 seg25 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 s 3 s 2 s 1 nc v cm nc v cp reset v dd nc nc xt nc xt com2 seg26 nc: no-connection pin 80-pin plastic qfp pin configuration (top view) (continued)
5/12 msm5052 ? semiconductor pad configuration pad layout seg4 seg5 seg6 seg7 seg8 seg9 seg10 seg11 seg12 seg13 seg14 seg15 seg16 seg17 seg18 seg19 seg20 seg21 seg22 seg23 seg1 com1 seg2 seg3 t 4 t 5 t 1 t 3 t 2 bd v ss2 v ss1 v dd seg26 com2 xt nc xt seg25 seg24 v dd reset v cp s 4 s 3 s 2 s 1 v cm m 1 m 3 m 2 ld m 4 k 1 k 2 k 3 k 4 osc c osc in osc r osc th chip size 4.77 4.36 (mm)
6/12 msm5052 ? semiconductor pin descriptions symbol description v dd ground. v ss1 power source (C1.5 v). v ss2 power source for lcd driver (C3.0 v). this pin is connected to the v dd pin through a 0.1 m f capacitor. v cp , v cm booster capacitor connection pins. v cp pin is connected to the v cm pin through a 0.1 m f capacitor. xt, xt input and output pins of oscillator inverter. a 32.768 khz crystal is connected to these pins. reset pin to clear internal logic, pulled down to v ss1 . after power is turned on, the msm5052 can be reset by this pin. bd buzzer output. osc th, osc r, osc c, osc in pins to rc oscillation circuit for temperature detection. these are the fundamental resistor, thermistor, and capacitor connection pins. t1 to t5 pins to test internal logic. t1, t2, t4, and t5 are pulled down to v ss1. t3 is the output. test pins are normally open.
7/12 msm5052 ? semiconductor absolute maximum ratings electrical characteristics dc characteristics parameter symbol condition min. typ. max. unit v ss1 operating voltage v ss1 v ss1 pin C1.65 C1.55 C1.25 v power supply current 1 i dd1 temperature sampling off (refer to measuring circuit) 3.0 *1 m a power supply current 2 i dd2 temperature sampling on (refer to measuring circuit) 100 *2 m a v osc within 10 seconds, v ss1 pin (refer to measuring circuit) C1.45 v output current 1 com C4 i om1 v om1 = v ss1 0.2 v C4 +4 i ol1 v ol1 = C2.8 v 4 output current 2 segment i oh2 C0.4 m a i ol2 0.4 output current 3 c, r, th v oh3 = C0.4 v C400 v ol3 = C1.15 v 400 m a output current 4 m 1 -m 4 , ld v oh4 = C0.4 v m a v ol4 = C1.15 v oscillation start voltage i oh1 v oh1 = C0.2 v m a (v dd = 0 v, v ss1 = C1.55 v, v ss2 = C3.0 v, c 1 = 30 pf, ta = 25c) v oh2 = C0.2 v v ol2 = C2.8 v i ol3 i oh3 i oh4 i ol4 C100 10 C200 C50 3 330 25 v oh5 = C0.4 v i oh5 v ol5 = C1.15 v i ol5 v in = 0 v i ih cd output current 5 bd input current s 1 -s 4 , k 1 -k 4 built-in cd capacitance m a pf m a C0.2 v in = C1.55 v i il parameter symbol condition unit rating power supply voltage v ss1 -v dd ta = 25c v C2.0 to +0.3 input voltage v in ta = 25c v v ss1 C 0.3 to +0.3 operating temperature t op c C20 to +75 storage temperature t stg c C55 to +125 *1 the typ. value varies depending on the application program. *2 the typ. value varies depending on the application program and rc thermistor to be used.
8/12 msm5052 ? semiconductor measuring circuit a xt v ss1 v dd v crystal 32.768 khz osc th v ss2 c 2 c 3 v cp v cm xt c 1 osc r osc c osc in c 4 r 1 r 2 : 20 pf : 0.1 m f : 3000 pf : 10 k w c 1 c 2 , c 3 c 4 r 1 , r 2 msm5052
9/12 msm5052 ? semiconductor v ss1 v dd reset k 1 osc th osc r com1 segments lcd msm5052 m 1 osc in osc c c 3 xt xt v cm r 1 r 2 : 33 k w : 20 k w : 40bt-5 com2 m 2 m 4 ld bd hi lo data latch alarm output serial data *1 piezo k 3 k 2 s 4 s 1 s 2 s 4 v ss2 c 4 c/f s 2 s 1 *2 v cp (cd = 25 pf) c 2 32.768 khz r 1 r 2 c 1 th th 40 k w 10% at 25c b = 3550 2% c 1 c 2 c 3 c 4 : 680 pf : 5 to 35 pf : 0.1 m f : 0.1 m f 12345 1 2 3 4 5 thermometer one-second sampling clock thermometer 10-second sampling the highest temperature alarm the lowest temperature alarm application circuit *1 inner switch or pad on pcb *2 bonding option
10/12 msm5052 ? semiconductor (unit : mm) package dimensions notes for mounting the surface mount type package the sop, qfp, tsop, soj, qfj (plcc), shp and bga are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. therefore, before you perform reflow mounting, contact okis responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). qfp56-p-910-0.65-k package material lead frame material pin treatment solder plate thickness package weight (g) epoxy resin 42 alloy solder plating 5 m m or more 0.36 typ. mirror finish
11/12 msm5052 ? semiconductor (unit : mm) notes for mounting the surface mount type package the sop, qfp, tsop, soj, qfj (plcc), shp and bga are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. therefore, before you perform reflow mounting, contact okis responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). qfp56-p-910-0.65-2k package material lead frame material pin treatment solder plate thickness package weight (g) epoxy resin 42 alloy solder plating 5 m m or more 0.43 typ. mirror finish
12/12 msm5052 ? semiconductor (unit : mm) notes for mounting the surface mount type package the sop, qfp, tsop, soj, qfj (plcc), shp and bga are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. therefore, before you perform reflow mounting, contact okis responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). qfp80-p-1420-0.80-bk package material lead frame material pin treatment solder plate thickness package weight (g) epoxy resin 42 alloy solder plating 5 m m or more 1.27 typ. mirror finish

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